DAGE4600W 全自動(dòng)焊接推拉力測(cè)試機(jī)
產(chǎn)品型號(hào)：4600WDage
簡(jiǎn)介介紹：4600-W鍵合測(cè)試儀是一種臺(tái)式系統(tǒng)，設(shè)計(jì)用于自動(dòng)執(zhí)行復(fù)雜的測(cè)試程序，無(wú)需操作員輸入。該系統(tǒng)可以自動(dòng)完成具有不同鍵方向的剪切和拉伸測(cè)試模式，同時(shí)在完成后記錄故障模式圖像
詳情介紹
Load large batches of samples and benefit from robotic handling to load, align and transfer each device to the Bondtester.
Applications:
Automatic testing for leadframe and wafers (<200mm)
Paragon? – Your automation partner
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Automation assisted GUI
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Build in check list & help
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Multi window views
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Schematic virtual images displayed
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Import maps or create your own
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Import wafer map file SINF / G85 / Klarf (AOI) / New Format
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Wire pull and ball shear pattern displays
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Colour gradients indicate different heights
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Inter-die wire corrections
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Map interface display
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Wire pull pattern
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Ball shear pattern
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Inter-die wire connections
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Remove uncertainty - camera assisted programming
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Ultimate accuracy using on-board cameras
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Both high resolution and field of view cameras as standard
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Fiducial images for alignment
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Automatic fiducial recognition
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On board camera live images during testing
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High resolution and FOV cameras
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Image every failure mode – even with extreme height variations
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Compound Surface Imaging (CSI) scans through a Z-stack to get every point in focus
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Automatically return to the failure site to record an image
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Assists with failure mode analysis
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Comes as standard with every 4600 Bondtester
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Compound surface imaging (CSI)
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Standard image
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專注為電子制造商提供如下SMT設(shè)備：
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錫膏印刷機(jī)、錫膏測(cè)厚儀SPI、SMT貼片機(jī)、HELLER回流焊、光學(xué)檢測(cè)AOI、X-Ray X光射線檢測(cè)機(jī)、等整條SMT生產(chǎn)線設(shè)備，以及服務(wù)和解決方案。
專注為封測(cè)廠提供如下半導(dǎo)體封測(cè)設(shè)備：
DieBond固晶機(jī)、DieAttach晶圓貼片機(jī)粘片機(jī)、WireBond焊線機(jī)引線鍵合機(jī)、Molding塑封機(jī)、WaferGrinding研磨機(jī)、WaferSaw切割機(jī)、X-RayDageX光檢測(cè)機(jī)、BondTest推拉力測(cè)試機(jī)、Plasma等離子清洗機(jī)、C-SAM超聲波掃描、原子力顯微鏡、先進(jìn)封裝電鍍等設(shè)備
提供從IC Design→Fabless→封裝測(cè)試→SMT表面組裝的整套集成電路電子制造的行業(yè)資源，設(shè)備及解決方案
